Defense science agency DARPA plans to start a new step in the development of electronics: create three-dimensional microchips with integrated water-cooling. The new chips are based on microfluidic developments will be 1,000 times faster than today’s.
Specialists DARPA plans to solve the main problem of potentially very productive 3D-processors using the smallest in its own kind of water cooling. Now advanced microchips stacked on top of each other like pancakes on a plate. This achieves the highest performance with ultra-compact size. But unlike modern microprocessors with multiple cores in a single plane, a massive 3D-chips difficult to cool.
In DARPA plan to solve this dilemma by means of the creation of the chips inside the tiny channels for water circulation. This development, for previously betrothed ICECool, will be a microfluidic cooling system, which otvodet heat from the cores on the cover of the microprocessor.
In microfluidics theory should work much better than the current air cooling. When all this is already the first ideas for the implementation of microfluidic cooling. Thus, according to the views of Dr. Krish Chakrabarty of Duke Institute can realize automatic disconnection of electrodes in the regions where it becomes very hot. With all of this on a plate indium tin oxide electrode and between the microfluidic channel is supplied with water, which absorbs and dissipates heat.
DARPA does not indicate what specific types of military systems receive first three-dimensional microfluidic chips with the cooling, although the need for them is actually in each area, for example for the production of experimental 50-gigapixel camera, high-performance phones etc. Brand new development will significantly increase the resolution of the thermal imager, the computational power of tactical networks, artificial intelligence systems.