Russian 300-mm wafers

Author: Oleg Artamonov

He went into the MSU to an old acquaintance. Familiar engaged in all sorts of nanovoprosami — nanotubes, nanolithography, and the like. Listened to fascinating stories about the shortcomings of multi-electron-beam lithography (it is difficult to focus as much rays, in which will be a big win on time compared with single-beam) and the problems of manufacturing mirrors for deep ultraviolet and X-ray (250 alternating layers with a thickness of 1.8 to 3.4 nm each, ie one coating layer — a few atoms in thickness).

Used at the same time in the hands of the product, and that somehow it was not possible before:

300-mm, that for chips drawn — I do not know.

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